Bibliograph

Induction curing of a phase-toughened adhesive, by Christian J. Yungwirth, Eric D. Wetzel, and James M. Sands

Type

Label

Induction curing of a phase-toughened adhesive, by Christian J. Yungwirth, Eric D. Wetzel, and James M. Sands

Language

eng

Bibliography note

Includes bibliographical references (p. 20-21)

resource.governmentPublication

federal national government publication

Illustrations

illustrations

Index

no index present

Literary Form

non fiction

Main title

Induction curing of a phase-toughened adhesive

Nature of contents

dictionariesbibliography

Oclc number

74250746

Responsibility statement

by Christian J. Yungwirth, Eric D. Wetzel, and James M. Sands

Series statement

ARL-TR, 2999

Summary

Phase-toughened epoxy/dicyandiamide adhesives were loaded with magnetic particle filler and then cured by induction processing. The effect of induction field magnitude and exposure time on bonding strength of the loaded adhesives was characterized. At low magnetic field amplitudes, bond strength increased significantly with exposure time, with the highest strength bonds occurring after 60-min exposures. At high magnetic field amplitudes, bond strength increased only slightly with exposure time, so that significant bond strength was reached after 15 min of exposure. In general, the induction-cured adhesives exhibited lower bond strengths than comparable oven-cured adhesives. All of these strength trends were likely due to process- induced variations in the adhesive degree of cure, toughening phase development, or thermal degradation

Contributor

Creator